Development of integrated circuit design industry supported by Chengdu

Recently, the policy of Chengdu hi tech Industrial Development Zone (hereinafter referred to as "the policy of Chengdu hi tech Industrial Development Zone to further promote the development of high-tech integrated circuit industry" was issued.

The policy supports enterprises from nine directions in four aspects: Reducing R & D and manufacturing costs of enterprises, rewarding enterprises to upgrade their energy level, helping enterprises to introduce high-end talents and accelerating the formation of industrial ecology.

The maximum subsidy is 5 million yuan

Reduce R & D and manufacturing costs of enterprises

In terms of reducing the R & D and manufacturing costs of enterprises, the policy gives different support according to different links of design, manufacturing and sealing test.

Design process:

Enterprises are encouraged to purchase IP (intellectual property rights) and EDA design tools.

For IC design enterprises that purchase IP (including foundryip modules) from IP providers and EDA design tools from EDA suppliers for R & D, subsidies of 50% of the purchase cost and the maximum annual total amount of 5 million yuan will be given.

Manufacturing link:

For the first application of MPW (multi project wafer) project, after identified as an advanced field, 80% of the wafer cost will be subsidized, with a maximum of 3 million yuan.

For the project that first applied for project batch production, after it is identified as an advanced field, 50% of the film production cost will be subsidized, with a maximum of 5 million yuan;

For the first batch production project, and the product sales revenue exceeds 5 million yuan, 30% of the mask cost will be subsidized, with a maximum of 2 million yuan;

If the conditions are met, if the enterprise realizes the local film production, the subsidy proportion and amount of the above support direction can further rise.

Sealing and testing link:

Enterprises are encouraged to use packaging testing enterprises to conduct the first round of packaging test. After being identified, packaging testing enterprises in the zone will be given a subsidy of up to 2 million yuan at 10% of the cost of packaging and testing;

For packaging testing enterprises outside the zone, a subsidy of up to 1 million yuan will be given according to 5% of the sealing and testing cost.

Chengdu national core fire innovation and entrepreneurship base located in the electronic information industry functional zone

The maximum reward is 30 million yuan

Encourage enterprises to expand their scale

The policy also accelerates the construction of IC ecosystem by encouraging enterprises to expand their scale, introduce talents and strengthen local cooperation.

For the high growth IC Design Enterprises with newly introduced projects or capital increase projects of stock enterprises, whose IC design business income reaches 100 million yuan, 300 million yuan, 500 million yuan and 1 billion yuan for the first time, they will be awarded 5 million yuan, 10 million yuan, 20 million yuan and 30 million yuan respectively after identification;

Senior managers and IC design and R & D personnel with an annual income of more than 200000 yuan will be awarded 100% according to their actual contribution;

For those enterprises that purchase chips independently developed, designed and produced by non affiliated enterprises, and the total purchase amount is more than 5 million yuan, a subsidy of 10% of the purchase amount and 5 million yuan of annual total amount will be given to the purchasers;

Enterprises (units) are encouraged to build integrated circuit public technology platform, and a one-time financial support of no more than 5 million yuan will be given to newly identified public technology platform of integrated circuit according to 50% of construction investment;

According to 20% of the service cost of the enterprise using the platform, the public technology platform will be given a subsidy of up to 200000 yuan per year.

Source: Chengdu hi tech